Gembird TG-G3.0-01 3 g Thermal Paste

Features:

- Keep your computer´s CPU cool
- Practical syringe for easy application
- Thermal compund (grease) for heatsinks
- Helps the heat dissipation from a CPU, chipset or processor to a heatsink
- Excellent thermal impedance
- Perfect stability - will not separate, run, migrate, or bleed
- Non capacitive or electrically conductive


Specifications:

- Weight: 3.0 g
- Thermal conductivity: 4.5 W / mK
- Thermal Impedance <0.205 ° C-in2 / W
- Density: 2.5
- Evaporation: 0.001 %
- Volatility: 0.005 %
- The dielectric constant: 5.1
- Dissipation Factor: 0.005
- Viscosity: 76 CPS
- Thixotropic index: 310 ± 10 ° C
- Operating Temperature: -50 ~ 240 ° C
- Composites: 50% silicone compounds
- Compounds: 30% of carbon
- The compounds of metal oxides: 20%

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